| 摘要 |
A LED package includes a LED die, and a memory device. The memory device is arranged for holding LED data information for driving the LED die. A LED driver arrangement includes a LED package as described above, a LED driver device and a microcontroller. The microcontroller is connected to the memory device for accessing the LED data information for driving the LED die and to the LED driver for sending an output flux settings signal. The LED driver device is connected to the LED die for providing a driving signal to the LED die, the driving signal being based on the output flux in package settings signal from the microcontroller.
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