发明名称 |
Thermoplastic resin composition and resin molding |
摘要 |
The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas is 1500 mug/g or less. The composition may comprise a surface resistivity reducing substance in an amount of 0.1 to 70 parts by mass relative to 100 parts by mass of the thermoplastic resin. The present invention is suitable to a composition comprising a styrenic resin as the thermoplastic resin. The surface resistivity reducing substrate is preferably a polyamide elastomer comprising a hard segment formed of polyamide 12 and a soft segment formed of poly(alkylene oxide)glycol. The polyamide elastomer preferably has a refractive index of 1.5 to 1.53, a melting point of 130 to 160° C., a solution viscosity of 1.35 to 1.70 and a surface resistivity of 1×108 to 1×1011Omega.
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申请公布号 |
US8563106(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US20100780253 |
申请日期 |
2010.05.14 |
申请人 |
SUMIMOTO NORIFUMI;TECHNO POLYMER CO., LTD. |
发明人 |
SUMIMOTO NORIFUMI |
分类号 |
C08L77/00;B65D1/09;B65D25/04;B65D25/10;C08J5/00;C08L25/08;C08L51/04;C08L101/00 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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