发明名称 |
Coaxial solder bump support structure |
摘要 |
A solder bump support structure and method of manufacturing thereof is provided. The solder bump support structure includes an inter-level dielectric (ILD) layer formed over a silicon substrate. The ILD layer has a plurality of conductive vias. The structure further includes a first insulation layer formed on the ILD layer. The solder bump support structure further includes a pedestal member formed on the ILD layer which includes a conductive material formed above the plurality of conductive vias in the ILD layer coaxially surrounded by a second insulation layer. The second insulation layer is thicker than the first insulation layer. The structure further includes a capping under bump metal (UBM) layer formed over, and in electrical contact with, the conductive material and formed over at least a portion of the second insulation layer of the pedestal member. |
申请公布号 |
US8563416(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US201113194616 |
申请日期 |
2011.07.29 |
申请人 |
ERWIN BRIAN MICHAEL;MELVILLE IAN D.;MISRA EKTA;SCOTT GEORGE JOHN;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ERWIN BRIAN MICHAEL;MELVILLE IAN D.;MISRA EKTA;SCOTT GEORGE JOHN |
分类号 |
H01L21/44;H01L21/4763 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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