SEMICONDUCTOR MEMORY MODULES AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor memory module and a method for fabricating the same are provided to protect the back surface of a memory component by forming a passivation layer on the back surface of the memory component directly mounted by a flip chip method. CONSTITUTION: A module substrate (210) has a first surface and a second surface. The second surface faces the first surface. Memory components (110) are directly mounted on the module substrate by a flip chip method. The memory components include a passivation layer. The passivation layer is formed by a vapor deposition method or a coating method.