发明名称 |
ETCHING SYSTEM AND CIRCUIT PATTERN FORMING METHOD USING THE SAME |
摘要 |
PURPOSE: An etching system and a method for forming a circuit pattern using the same are provided to directly form the circuit pattern with jetting an etchant on a copper substrate at a high speed, thereby simplifying a process and reducing cost for manufacturing a product. CONSTITUTION: An etching system includes a computer aided design/computer aided manufacturing (CAD/CAM) master (210), a head part (220), a head part driving unit (230), an etchant jetting nozzle (240), and an etchant storage tank (250). The CAD/CAM master designates an etching parameter, and prepares design data for a circuit pattern predetermined by a user. The head part moves on a substrate according to the design data. The head part driving unit provides the head part with a driving force. The etchant jetting nozzle jets an etchant according to the movement of the head part. The etchant storage tank feeds the etchant inside the same to the etchant jetting nozzle. [Reference numerals] (210) CAD/CAM master; (230) Head part driving unit; (250) Etchant storage tank |
申请公布号 |
KR20130115843(A) |
申请公布日期 |
2013.10.22 |
申请号 |
KR20120038542 |
申请日期 |
2012.04.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, HYE JIN;KIM, GOING SIK;RYU, CHANG SUP |
分类号 |
C23F1/08;H05K3/06 |
主分类号 |
C23F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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