| 摘要 |
Provided is a cleaving apparatus for a band-like glass film and a cleaving method for a band-like glass film, in which at least one surface (effective surface) of the band-like glass film is held in a non-contact state to suppress a situation that wavy portions reach a region in which the band-like glass film is to be cleaved. The cleaving apparatus for a band-like glass film (1) cleaves the band-like glass film (2), which is being conveyed in a longitudinal direction thereof, along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region resulting from the localized heating, the localized heating and the cooling being performed on a preset cleaving line extending along the conveyance direction of the band-like glass film (2). The cleaving apparatus includes: a conveyor (3) for supporting a back surface side of the band-like glass film (2); and an air knife (5) for supplying air to a front surface of the band-like glass film (2) while supporting, by the conveyor (3), the back surface side of the band-like glass film (2) to retain the band-like glass film on the conveyor (3) at a position on an upstream side of a cleaving region (R), in which the band-like glass film (2) is to be cleaved, in the conveyance direction. |
