| 摘要 |
<p>A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step. In a part 50 extending along a line to cut in an object to be processed 1, laser light L is oscillated in a pulsing fashion in an intermediate portion 51 including an effective part 41, and is continuously oscillated in one end portion 52 and the other end portion 53 on both sides of the intermediate portion 51. Since the laser light intensity becomes lower in continuous oscillation than in pulse oscillation, modified regions 71, 72, 73 can be formed in the intermediate portion 51 but not in one end portion 52 and the other end portion 53. This keeps the modified regions 71, 72, 73 from reaching the outer face of the substrate 4, thus making it possible to prevent particles from occurring when forming the modified regions 71, 72, 73.</p> |
