PURPOSE: An apparatus for forming an electronic material film is provided to prevent the electronic material film from being damaged by blocking charged particles on a substrate. CONSTITUTION: A sputtering process is performed in a chamber. A sputtering device (21) mounts an electronic material film target. The electronic material film target is made of transparent conductive oxide materials. A holding device (31) is arranged on a side which is opposite to the inner side of the chamber with the sputtering device. A limiter (40) includes a plurality of slits.
