| 摘要 |
PURPOSE: A method for processing a sapphire wafer is provided to increase a processing speed two or three times by dividing a chip with a blade. CONSTITUTION: A dicing tape is mounted on an annular frame. A sapphire wafer is bonded to the dicing tape. A plurality of wafers are received in a wafer cassette (8). The wafer cassette is arranged on a cassette elevator (9). An input and output unit (10) is installed on the rear side of the wafer cassette. |
