SYSTEM AND METHOD FOR OPTIMIZING AND COMBINING ADHESIVE PARAMETERS

摘要

The described embodiment relates generally to the field of adhesives. More specifically the described embodiment allows a thin adhesive layer to have additional properties not otherwise available in a homogenous adhesive layer. By combining a variety of adhesive material types into a thin interlocked adhesive layer, properties such as multi-surface adhesion, electrical conductivity, and thermal conductivity can be achieved in a robust adhesive layer.