发明名称 COMPOUND MODULE
摘要 <p>Provided is a compound module that does not impose a load on a host CPU that is mounted in a host device. A wireless communication module (10) serving as this compound module is connected to the host device (30), and is a wireless communication module (10) for controlling, in the host device (30), a function for wireless communication with an external terminal. The wireless communication module (10) contains: an MCU (12) containing a wireless communication control CPU (12a); a wireless communication IC (14); and ROM (12b) for storing a driver that is for a wireless communication module for installing the wireless communication module (10) in the host device (30). The wireless communication control CPU (12a) controls the wireless communication IC (14), and processes the driver that is for the wireless communication module.</p>
申请公布号 WO2013153893(A1) 申请公布日期 2013.10.17
申请号 WO2013JP56769 申请日期 2013.03.12
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KAWANO, KOJI
分类号 H04B1/38 主分类号 H04B1/38
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