WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board having high reliability and a method for manufacturing the same.SOLUTION: The wiring board includes: an interlayer insulating layer 26a; a conductor layer 31a formed on the interlayer insulating layer 26a; an interlayer insulating layer 33a provided on the interlayer insulating layer 26a and the conductor layer 31a; a sub wiring board 10 which is arranged on the interlayer insulating layer 26a and has an insulating layer 110 and a conductor layer 111 on an insulating layer 120; a conductor layer 36a formed on the interlayer insulating layer 33a; and a via conductor 35a which is formed inside the interlayer insulating layer 33a and connects the conductor layer 31a and the conductor layer 36a.