SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a substrate for power module with a heat sink brazed firmly under normal pressure conditions without using flux, and to provide a manufacturing method therefor.SOLUTION: The substrate for power module with a heat sink includes a substrate for power module having a circuit layer placed on one surface of an insulation layer, and a heat sink bonded to the other surface of the substrate for power module. The bonding surface of the heat sink and the bonding surface of the substrate for power module are composed, respectively, of aluminum or an aluminum alloy. On the bonded interface of the heat sink and the substrate for power module, a junction layer 50 where an Mg-containing compound 52 (excepting MgO) is dispersed into an Al-Si eutectic structure is formed, and the thickness t of the junction layer 50 is in the range of 5-80 μm.