| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent quality deterioration in treatment for forming a coating film on a wafer.SOLUTION: A substrate processing apparatus comprises: a coating treatment unit 31; a heat treatment unit 41; a first main transfer mechanism Tfor transferring a wafer W with respect to respective treatment units 31, 41; a second main transfer mechanism Tto which the wafer W is transferred from the first main transfer mechanism Tvia a placement part PASS; and a buffer part BF2 on which the wafer W is placed when the wafer W cannot be placed on the placement part PASS. By doing this, the first main transfer mechanism Tcan continue to transfer the wafer W. Accordingly, other wafers W in respective treatment units 31, 41 are transferred between the treatment units 31, 41 without delay, and a series of treatments including coating treatment and heat treatment is performed as scheduled. As a result, quality deterioration in treatment for forming a coating film on the wafer W. |
