发明名称 System and Method for Step Coverage Measurement
摘要 Determining an unknown step coverage of a thin film deposited on a 3D wafer includes exposing a planar wafer comprising a first film deposited thereon to X-ray radiation to create first fluorescent radiation; detecting the first fluorescent radiation; measuring a number of XRF counts on the planar wafer; creating an XRF model of the planar wafer; providing a portion of the 3D wafer comprising troughs and a second film deposited thereon; determining a multiplier factor between the portion of the 3D wafer and the planar wafer; exposing the portion of the 3D wafer to X-ray radiation to create second fluorescent radiation; detecting the second fluorescent radiation; measuring a number of XRF counts on the portion of the 3D wafer; calculating a step coverage of the portion of the 3D wafer; and determining a uniformity of the 3D wafer based on the step coverage of the portion of the 3D wafer.
申请公布号 US2013272496(A1) 申请公布日期 2013.10.17
申请号 US201313914848 申请日期 2013.06.11
申请人 INTERMOLECULAR, INC. 发明人 CHEN HANHONG;HAYWOOD EDWARD;KUMAR PRAGATI
分类号 G01N23/223 主分类号 G01N23/223
代理机构 代理人
主权项
地址