发明名称 MULTIBAND RF SWITCH GROUND ISOLATION
摘要 A radio frequency (RF) switch semiconductor die and an RF supporting structure are disclosed. The RF switch semiconductor die is attached to the RF supporting structure. The RF switch semiconductor die has a first edge and a second edge, which may be opposite from the first edge. The RF supporting structure has a group of alpha supporting structure connection nodes, which is adjacent to the first edge; a group of beta supporting structure connection nodes, which is adjacent to the second edge; and an alpha AC grounding supporting structure connection node, which is adjacent to the second edge. When the group of alpha supporting structure connection nodes and the alpha AC grounding supporting structure connection node are active, the group of beta supporting structure connection nodes are inactive.
申请公布号 US2013271224(A1) 申请公布日期 2013.10.17
申请号 US201313911428 申请日期 2013.06.06
申请人 RF MICRO DEVICES, INC. 发明人 PULIAFICO ANTHONY;JONES DAVID E.;JONES PAUL D.;LEVESQUE CHRIS;SOUTHCOMBE WILLIAM DAVID;YODER SCOTT;STOCKERT TERRY J.
分类号 H03F3/19 主分类号 H03F3/19
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