| 摘要 |
PROBLEM TO BE SOLVED: To provide a further improvement for suppressing frictional generation of Sn powder in an Sn-plated material.SOLUTION: An Sn-plated material includes a reflow Sn-plating layer on a substrate made of copper or a copper alloy directly or via a base plating. The reflow Sn-plating layer is constituted of an Sn layer on an upper side and a Cu-Sn alloy layer on a lower side. In the Sn-plated material, a Cu-Sn alloy particle with a particle size of 10-100 nm is present at a number density of 50-1,000 pcs/μmwhen a section of the Sn layer is observed. |
