发明名称 |
DYNAMIC OPERATIONS FOR 3D STACKED MEMORY USING THERMAL DATA |
摘要 |
Dynamic operations for operations for 3D stacked memory using thermal data. An embodiment of a memory device includes memory having multiple coupled memory elements and multiple thermal sensors, including a first thermal sensor in a first area of the memory stack and a second thermal sensor in a second area of the memory stack. A memory controller is to provide operations to modify thermal conditions of the memory elements based at least in part on thermal information generated by the thermal sensors.
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申请公布号 |
US2013275665(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
US201113995899 |
申请日期 |
2011.09.30 |
申请人 |
SARASWAT RUCHIR;GRIES MATTHIAS |
发明人 |
SARASWAT RUCHIR;GRIES MATTHIAS |
分类号 |
G06F12/00 |
主分类号 |
G06F12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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