| 摘要 |
This semiconductor device is provided with a first semiconductor chip, and a second semiconductor chip, which is connected on the first semiconductor chip by chip-on-chip connection. When the semiconductor device is viewed from the direction perpendicular to the upper surface of the second semiconductor chip, the outer shape of the second semiconductor chip is larger than the outer shape of the first semiconductor chip. On the upper surface of the first semiconductor chip, a plurality of first semiconductor chip electrode terminals are provided, and the first semiconductor chip electrode terminals include one or a plurality of first shielded terminals, which are covered with the second semiconductor chip, and one or a plurality of first open terminals, which are not covered with the second semiconductor chip. |
