发明名称 BALL MOUNTING METHOD AND SUBSTRATE-WORKING MACHINE
摘要 Provided is a substrate-working machine, comprising a work device that selectively executes the work of mounting a conductive ball onto a circuit substrate using a ball holder (82) and the work of transferring an viscous fluid onto the circuit substrate using a transfer pin, and a tray in which the viscous fluid is stored, wherein, when the conductive ball is mounted onto the circuit substrate, the viscous fluid is transferred onto the circuit substrate using the transfer pin and then the conductive ball, immersed in the viscous fluid, is mounted on top of the transferred viscous fluid. This configuration enables the conductive ball to be secured onto the circuit substrate by using the viscous fluid transferred to the circuit substrate using the transfer pin and by using the viscous fluid adhered to the conductive ball due to the conductive ball being immersed in the adhesive fluid, and enables the conductive ball to be appropriately mounted onto the circuit substrate using a large quantity of the viscous fluid.
申请公布号 WO2013153616(A1) 申请公布日期 2013.10.17
申请号 WO2012JP59769 申请日期 2012.04.10
申请人 FUJI MACHINE MFG. CO., LTD.;OKA, HIROMITSU;HAYASHI, TETSUO 发明人 OKA, HIROMITSU;HAYASHI, TETSUO
分类号 H05K3/34;B23K3/06;H01L21/60 主分类号 H05K3/34
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