发明名称 SYSTEM IN PACKAGE ASSEMBLY
摘要 A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board
申请公布号 US2013271924(A1) 申请公布日期 2013.10.17
申请号 US201313783722 申请日期 2013.03.04
申请人 QUANTA COMPUTER INC. 发明人 SHEN LI-CHENG
分类号 H05K1/18;H05K13/00 主分类号 H05K1/18
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