发明名称 Coating a substrate, comprises arranging substrate parallel with respect to first main surface, traversing substrate by film-forming raw material, forming sequence of layers, guiding raw material flowing via inlet opening and dissipating
摘要 <p>Coating at least one substrate (100) having a first main surface (1) and a second main surface (2) opposite to first main surface, comprises arranging the substrate parallel to the direction of gravity in a chamber with respect to first main surface; traversing the substrate by at least one film-forming raw material; forming a sequence of layers at least on first main surface of substrate; guiding the film-forming raw material flowing through at least one inlet opening (7); and at least partially dissipating the film-forming raw material by at least one outlet opening (8) of chamber. Coating at least one substrate (100) having a first main surface (1) and a second main surface (2) opposite to first main surface, comprises arranging the substrate parallel to the direction of gravity in a chamber with respect to the first main surface; traversing the substrate by at least one film-forming raw material; forming a sequence of layers at least on the first main surface of the substrate, where at least one sequence of layers comprises semiconductor material; guiding the film-forming raw material flowing through at least one inlet opening (7) into the chamber; and at least partially dissipating the film-forming raw material by at least one outlet opening (8) of chamber.</p>
申请公布号 DE102012103204(A1) 申请公布日期 2013.10.17
申请号 DE201210103204 申请日期 2012.04.13
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 WECHSELBERGER, BERND
分类号 C23C16/455;C23C16/458;C23C16/46;H01L21/67 主分类号 C23C16/455
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