发明名称 |
Coating a substrate, comprises arranging substrate parallel with respect to first main surface, traversing substrate by film-forming raw material, forming sequence of layers, guiding raw material flowing via inlet opening and dissipating |
摘要 |
<p>Coating at least one substrate (100) having a first main surface (1) and a second main surface (2) opposite to first main surface, comprises arranging the substrate parallel to the direction of gravity in a chamber with respect to first main surface; traversing the substrate by at least one film-forming raw material; forming a sequence of layers at least on first main surface of substrate; guiding the film-forming raw material flowing through at least one inlet opening (7); and at least partially dissipating the film-forming raw material by at least one outlet opening (8) of chamber. Coating at least one substrate (100) having a first main surface (1) and a second main surface (2) opposite to first main surface, comprises arranging the substrate parallel to the direction of gravity in a chamber with respect to the first main surface; traversing the substrate by at least one film-forming raw material; forming a sequence of layers at least on the first main surface of the substrate, where at least one sequence of layers comprises semiconductor material; guiding the film-forming raw material flowing through at least one inlet opening (7) into the chamber; and at least partially dissipating the film-forming raw material by at least one outlet opening (8) of chamber.</p> |
申请公布号 |
DE102012103204(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
DE201210103204 |
申请日期 |
2012.04.13 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
WECHSELBERGER, BERND |
分类号 |
C23C16/455;C23C16/458;C23C16/46;H01L21/67 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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