| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for process, by which a bump is stably formed and the yield of a semiconductor device is improved, and to provide a method of manufacturing the semiconductor device, by which the yield of the semiconductor device is improved.SOLUTION: A film for process is the film for process to be used for the manufacture of the semiconductor device. The film for process is used to peel off a semiconductor member after the semiconductor member is fixed to the film for process to form the bump, and the adhesive force of the film for process after heated at 80°C for 4 hours is ≥60 cN/25 mm and ≤1000 cN/25 mm. |
