| 摘要 |
For obtaining a terminal capable of being soldered to a substrate without causing trouble such as a short circuit or poor connection, a lead part 13 is plated with tin in a state joined to a joining part 42 of a carrier, and a notch part 44, whose thickness is thinned, cut by a cutter 51 from a soldering surface side for making connection to a conductor pattern is formed between the lead part 13 and the joining part 42. The notch part 44 is provided with a guide part for guiding the cutter 51 to a side of the joining part 42 and forming a fillet forming piece 17 made of a part of the notch part 44 on a side of the lead part 13 after cutting by the cutter 51.
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