HEAT DISSIPATION FEATURES, ELECTRONIC DEVICES INCORPORATING HEAT DISSIPATION FEATURES, AND METHODS OF MAKING HEAT DISSIPATION FEATURES

摘要

Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (rho), and specific heat (Cp) such that the product of k*rho*Cp results in a value less than a product of k*rho*Cp for human skin.