| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-cyanogen based gold electroplating bath which suppresses the diffusion of the opening part of a mask material upon plating, and can form a bump and wiring with dimensions practically equal to the designed dimensions. SOLUTION: The non-cyanogen based gold electroplating bath for forming a bump comprises: the alkali salt of gold sulfite or ammonium gold sulfite as a gold source; water soluble amine as a stabilizer; a crystal regulator; a sulfite and a sulphate as conducting salts; a buffer; polyalkylene glycol and/or an amphoteric surfactant. The amount of the polyalkylene glycol to be blended is preferably 0.1 mg to 10 g/L. The amount of the amphoteric surfactant to be blended is preferably 0.1 mg to 1 g/L. As the amphoteric surfactant, carboxybetaines can be preferably used. COPYRIGHT: (C)2007,JPO&INPIT |
