发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition, a method for producing a pattern, and an electronic component which enable development with an alkaline aqueous solution and give a pattern in a good shape with excellent heat resistance and mechanical properties.SOLUTION: The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure crosslinkable or polymerizable with said component (a) by heat, represented by a general formula (3).
申请公布号 JP2013214094(A) 申请公布日期 2013.10.17
申请号 JP20130135612 申请日期 2013.06.27
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 MINEGISHI TOMONORI;KAWAMURA TOMOKO;OE TADAYUKI;NAKAMURA YUKI
分类号 G03F7/023;C08G73/22;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/023
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