发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, AND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition, a method for producing a pattern, and an electronic component which enable development with an alkaline aqueous solution and give a pattern in a good shape with excellent heat resistance and mechanical properties.SOLUTION: The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure crosslinkable or polymerizable with said component (a) by heat, represented by a general formula (3). |
申请公布号 |
JP2013214094(A) |
申请公布日期 |
2013.10.17 |
申请号 |
JP20130135612 |
申请日期 |
2013.06.27 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
MINEGISHI TOMONORI;KAWAMURA TOMOKO;OE TADAYUKI;NAKAMURA YUKI |
分类号 |
G03F7/023;C08G73/22;G03F7/004;G03F7/40;H01L21/027 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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