发明名称 METHOD FOR MANUFACTURING ELECTROFORMED COMPONENT
摘要 <p>Provided is a method for manufacturing an electroformed component that is manufactured by electroforming to form a component with a high width-to-height ratio. The present invention comprises: a step for roughening the substrate surface of a metal substrate (10) during a process for transplanting a component (40) so as to prevent the falling over or detachment of the component (40); a step for forming a photoresist pattern (30), which is the inverse pattern of a component pattern, to a desired thickness (T) so as to form a desired aspect ratio for the component (40); a step for forming the component to a height (t) equal to or less than the desired thickness (T) by electroforming with the photoresist pattern (30) serving as a mask; a step for removing the photoresist pattern (30); and a step for transplanting the formed component (40) to a component substrate (90).</p>
申请公布号 WO2013153578(A1) 申请公布日期 2013.10.17
申请号 WO2012JP02550 申请日期 2012.04.12
申请人 LEAP CO., LTD;SANO, TAKASHI;TERADA, TOKINORI 发明人 SANO, TAKASHI;TERADA, TOKINORI
分类号 C25D1/10;H01L21/60 主分类号 C25D1/10
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