发明名称 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming a resist underlayer film, the composition having excellent storage stability and capable of reducing generation of coating defects, and to provide a pattern forming method using the composition for forming a resist underlayer film.SOLUTION: The composition for forming a resist underlayer film comprises [A] a polysiloxane and [B] an organic solvent. The [B] organic solvent includes (B1) alkylene glycol monoalkylether acetates having a standard boiling point of lower than 150.0°C and (B2) an organic solvent having a standard boiling point of 150.0°C or higher. The content percentage of the (B1) alkylene glycol monoalkylether acetates in the [B] organic solvent is 50 mass% or more and 99 mass% or less, while the content percentage of the (B2) organic solvent is 1 mass% or more and 50 mass% or less. The standard boiling point of the (B2) organic solvent is preferably 180°C or higher.
申请公布号 JP2013214040(A) 申请公布日期 2013.10.17
申请号 JP20130010011 申请日期 2013.01.23
申请人 JSR CORP 发明人 SEKO TOMOAKI;TOYOKAWA IKUHIRO;MATSUMURA YUJI;KIMURA TORU
分类号 G03F7/11;C08G77/18;C08K5/101;C08L83/06;G03F7/26;H01L21/027 主分类号 G03F7/11
代理机构 代理人
主权项
地址