| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for solving the problem of fracture of an adhesive film, in a method of forming a chip having an adhesive film stuck onto the back.SOLUTION: The method of forming a chip with an adhesive film includes an expand sheet sticking step for sticking an expand sheet onto an adhesive film stuck to a wafer following to an adhesive film split groove formation step, and a division step for dividing the wafer and the adhesive film into individual chips by expanding the expand sheet thereby imparting an external force to the wafer, following to the expand sheet sticking step. |
