发明名称 |
ON-CHIP CAPACITORS AND METHODS OF ASSEMBLING SAME |
摘要 |
An on-chip capacitor a semiconductive substrate is fabricated in a passivation layer that is above the back-end metallization. At least three electrodes are configured in the on-chip capacitor and power and ground vias couple at least two of the at least three electrodes. The first via has a first-coupled configuration to at least one of the first- second- and third electrodes and the second via has a second-coupled configuration to at least one of the first- second- and third electrodes.
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申请公布号 |
US2013270675(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
US201113995525 |
申请日期 |
2011.10.01 |
申请人 |
CHILDS MICHAEL A.;FISCHER KEVIN J.;NATARAJAN SANJAY S. |
发明人 |
CHILDS MICHAEL A.;FISCHER KEVIN J.;NATARAJAN SANJAY S. |
分类号 |
H01L23/522 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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