发明名称 THERMAL INSULATION LAYER AND PRESSURE TRANSFER MEDIUM FOR HIGH-PRESSURE HIGH-TEMPERATURE CELL
摘要 <p>A thermal insulation layer for an HPHT cell, the thermal insulation layer including CsC1, CsBr, CsI, or a combination thereof, and the thermal insulation layer being electrically insulating; the thermal insulation layer including a thermal insulation sleeve and/or a thermal insulation button for an HPHT cell; a pressure transfer medium for an HPHT cell, the pressure transfer medium including CsBr, CsI or a combination thereof; and a pressure transfer medium for an HPHT cell, the pressure transfer medium including CsCl and additive, with the proviso that the additive does not include ZrO2 are disclosed. HPHT press systems that include a thermal insulation layer or a pressure transfer medium according to embodiments of the present disclosure are also disclosed.</p>
申请公布号 WO2013154955(A1) 申请公布日期 2013.10.17
申请号 WO2013US35549 申请日期 2013.04.08
申请人 SMITH INTERNATIONAL INC. 发明人 BAO, YAHUA;BELNAP, J. DANIEL;MIDDLEMISS, STEWART N.
分类号 C23C30/00;C23C26/00 主分类号 C23C30/00
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