发明名称 ROUND-TRIP ENVELOPE
摘要 <p>The present invention addresses the problem of providing a round-trip envelope on which an address for an original message and an address for a reply message can be recorded with room to spare, the original/reply message can be sealed without increasing the size of a sealing strip, the contents of the original/reply messages can be prevented from distracting from each other, and postmark errors on stamps, etc., are not prone to occur. The present invention is a round-trip envelope in which an original-message stamp affixing area (111a) and an original-message recipient address writing area (112a) are provided on a front surface (110) of an envelope body (100), a reply-message stamp affixing area (121a) and a reply-message recipient address writing area (122a) are provided on a back surface (120), a first opening (101) and first sealing strip (200), and a second opening (102) and second sealing strip (300) are provided at two different edges of the envelope body (100), the first sealing strip (200) in a state of being folded in advance toward the back surface (120) is bonded in a bonding area (202) near the first opening (101), and a non-bonding area on a peripheral side separated from the bonding area (202) is configured as a reply-message sealing strip (201).</p>
申请公布号 WO2013153593(A1) 申请公布日期 2013.10.17
申请号 WO2012JP59637 申请日期 2012.04.09
申请人 SONG CO., LTD.;SONG, KOON CHUL 发明人 SONG, KOON CHUL
分类号 B65D27/06 主分类号 B65D27/06
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