发明名称 |
CIRCUIT CONNECTION MATERIAL, CONNECTION STRUCTURE, AND FABRICATION METHOD FOR SAME |
摘要 |
<p>Provided is a circuit connection material for connecting a first circuit member that has a first circuit electrode formed on top of the main surface of a first substrate, and a second circuit member that has a second circuit electrode formed on top of the main surface of a second substrate, in a state where the first circuit electrode and the second circuit electrode are disposed facing each other. The circuit connection material comprises a radical polymerization initiator, a radical polymerization material and a thiol compound containing a thiol group in which the number of hydrogen atoms that will bond with the carbon atoms to which the thiol group has bonded is 1 or 0, and the thiol compound content is 7-17 parts by weight per 100 parts by weight of radical polymer material.</p> |
申请公布号 |
WO2013154203(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
WO2013JP61216 |
申请日期 |
2013.04.15 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAZAWA TAKASHI;TAKEMURA KENZOU |
分类号 |
C09J4/00;C09J5/06;C09J9/02;C09J11/06;H01R11/01;H05K1/14;H05K3/32;H05K3/36 |
主分类号 |
C09J4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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