发明名称 CIRCUIT CONNECTION MATERIAL, CONNECTION STRUCTURE, AND FABRICATION METHOD FOR SAME
摘要 <p>Provided is a circuit connection material for connecting a first circuit member that has a first circuit electrode formed on top of the main surface of a first substrate, and a second circuit member that has a second circuit electrode formed on top of the main surface of a second substrate, in a state where the first circuit electrode and the second circuit electrode are disposed facing each other. The circuit connection material comprises a radical polymerization initiator, a radical polymerization material and a thiol compound containing a thiol group in which the number of hydrogen atoms that will bond with the carbon atoms to which the thiol group has bonded is 1 or 0, and the thiol compound content is 7-17 parts by weight per 100 parts by weight of radical polymer material.</p>
申请公布号 WO2013154203(A1) 申请公布日期 2013.10.17
申请号 WO2013JP61216 申请日期 2013.04.15
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 NAKAZAWA TAKASHI;TAKEMURA KENZOU
分类号 C09J4/00;C09J5/06;C09J9/02;C09J11/06;H01R11/01;H05K1/14;H05K3/32;H05K3/36 主分类号 C09J4/00
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