| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which prevents failures, such as cracks and chips, occurring on a sand blast processed surface and where mesh sheet frames are formed in a waste board region.SOLUTION: Mesh sheet frames are formed on front and rear surfaces in a waste board region. Further, conductors of the mesh sheet frames formed on the front and rear surfaces in the waste board region are connected by via holes for interlayer connection. |
