发明名称 |
INJECTION MOLD. |
摘要 |
<p>An injection mold includes a first mold part provided with a first mold surface and a second mold part provided with a second mold surface to form a cavity together with the first mold surface. Cooling channels along which a cooling fluid flows are provided in at least one of the first mold part and the second mold part, and a heat generating layer which receives power and then generates heat is disposed on the inner surfaces of the cooling channels and serves as a heater.</p> |
申请公布号 |
MX2013006558(A) |
申请公布日期 |
2013.10.17 |
申请号 |
MX20130006558 |
申请日期 |
2011.11.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JIN HYUN CHO;JIN SUB KIM;JONG WON LEE |
分类号 |
B29C45/73;B29C45/72;B29C45/82 |
主分类号 |
B29C45/73 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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