发明名称 INJECTION MOLD.
摘要 <p>An injection mold includes a first mold part provided with a first mold surface and a second mold part provided with a second mold surface to form a cavity together with the first mold surface. Cooling channels along which a cooling fluid flows are provided in at least one of the first mold part and the second mold part, and a heat generating layer which receives power and then generates heat is disposed on the inner surfaces of the cooling channels and serves as a heater.</p>
申请公布号 MX2013006558(A) 申请公布日期 2013.10.17
申请号 MX20130006558 申请日期 2011.11.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JIN HYUN CHO;JIN SUB KIM;JONG WON LEE
分类号 B29C45/73;B29C45/72;B29C45/82 主分类号 B29C45/73
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