发明名称 COMPOSITION AND METHOD FOR REMOVING EXTRANEOUS MATTER
摘要 PROBLEM TO BE SOLVED: To provide a composition for removing adherent materials, capable of removing the adherent materials attached to a surface of a solid, even at an uneven place and a place where electric power cannot be ensured.SOLUTION: A composition for removing adherent materials attached to a surface of a solid comprises a rubber latex and/or a resin emulsion, and a surfactant.
申请公布号 JP2013213149(A) 申请公布日期 2013.10.17
申请号 JP20120084526 申请日期 2012.04.03
申请人 MEIWA CHEMICAL INDUSTRY CO LTD 发明人 TANAKA ISAMU;MINATO MASAHIRO
分类号 C11D3/37;B08B7/04;C11D3/12 主分类号 C11D3/37
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