| 摘要 |
PROBLEM TO BE SOLVED: To reduce influences on mechanical loads of adjacent semiconductor chips to promote peeling of a semiconductor chip from metal foil.SOLUTION: A method of peeling a semiconductor chip from metal foil includes: using a die ejector equipped with a plate 8 having a linear support edge and an L-shaped support edge; lifting the plate to a height Hon the upper surface of a cover plate 3; lowering first one pair of plates having the L-shaped support edge; optionally lowering second one pair of plates having the L-shaped support edge; lifting the plate which is not yet lowered to a height H>H; shifting and lowering the plate which is not yet lowered and not lowering at least one or some plates; optionally lowering the plate which is not yet lowered to a height H<H; lowering the plate until all plates are lowered; and separating a chip gripper. The chip gripper contacts a semiconductor chip 5 before lowering the last three plates. |
