METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE AND POWER MODULE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a power module substrate and a power module substrate, capable of preventing peeling of a nickel plating film to which a bonding wire is connected.SOLUTION: A method for manufacturing a power module substrate comprises the steps of: joining a circuit layer 6 to a ceramic substrate 2 by blazing; etching a surface of the circuit layer 6 joined by blazing (first etching processing step); performing blast treatment for the surface of the circuit layer 6 after the first etching processing step; etching the surface of the circuit layer 6 again after the blast treatment (second etching processing step); and forming a nickel plating film 9 on the circuit layer 6 after the second etching processing step. The second etching processing step removes the surface of the circuit layer 6 not less than 0.8 μm.