| 发明名称 |
Integrated Thermal Solutions for Packaging Integrated Circuits |
| 摘要 |
A method includes attaching a wafer on a carrier through an adhesive, and forming trenches in the carrier to convert the carrier into a heat sink. The heat sink, the carrier, and the adhesive are sawed into a plurality of packages.
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| 申请公布号 |
US2013273694(A1) |
申请公布日期 |
2013.10.17 |
| 申请号 |
US201213444662 |
申请日期 |
2012.04.11 |
| 申请人 |
HSIEH CHENG-CHIEH;HOU SHANG-YUN;JENG SHIN-PUN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSIEH CHENG-CHIEH;HOU SHANG-YUN;JENG SHIN-PUN |
| 分类号 |
H01L21/822 |
主分类号 |
H01L21/822 |
| 代理机构 |
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代理人 |
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