WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and the like which has improved pressure resistance against stress at a solder joint part and improved long-term reliability.SOLUTION: A wiring board assembly 1 comprises: a wiring board 2 including a plurality of insulation substrates 11 which include an insulation layer 12 and a wiring layer 13, and pads 15 formed on the insulation substrate 11; and a semiconductor component 3 joined on the pads 15 by solder bumps 16. The wiring board 2 includes a reinforcement member 40 which has a thickness thinner than that of the insulation layer 12; and has a thermal expansion coefficient smaller than a thermal expansion coefficient of each of the wiring layer 13 and the insulation layer 12; and has a high Young's modulus.