| 摘要 |
PROBLEM TO BE SOLVED: To provide an integration acoustic device which enables an acoustic device to be manufactured at low costs while preventing the damage to an integrated circuit with a simple structure, and to provide a manufacturing method of the integration acoustic device.SOLUTION: An integration acoustic device 10 is formed so as to include an integrated circuit board 11 including an integrated circuit formed therein, a resin layer 13 provided on the integrated circuit board, and an acoustic device 12 formed on the resin layer 13. A clearance 16 may be defined between the resin layer 13 and the acoustic device 12. A base layer 17 may be placed between the resin layer 13 and the acoustic device 12. The acoustic device 12 may cooperate with the integrated circuit in the integrated circuit board to function as a frequency reference oscillator or a resonance type sensor. |
