发明名称 THICK FILM COMPOSITION FOR FORMING THERMISTOR, PASTE COMPOSITION, AND THERMISTOR USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thick-film thermistor formation composition used for forming a thick-film thermistor which dose not contain lead on a ceramic substrate, a paste composition, and a reliable thermistor using the same in which change in resistance value under voltage load is small.SOLUTION: A thick-film thermistor formation composition contains ruthenium base conductive particle (A), glass frit powder (B), and Pd-Ag base powder (C). The ruthenium system conductive particle (A) is at least one kind of conductive particle selected from among YRuO, NdRuO, SmRuO, and GdRuO. The glass frit powder (B) is such powder as contains no Pb and Cd. Further, the Pd-Ag base powder (C) is selected from among Ag powder, Pd powder, and Pd-Ag alloy powder, with a weight ratio Pd/(Ag+Pd) of Ag and Pd being 0-60%, while, relating to content of each component, the ruthenium system conductive particle (A) being 4-60 wt.%, the glass frit powder (B) being 10-80 wt.%, and the Pd-Ag base powder (C) being 5-60 wt.%.
申请公布号 JP2013214591(A) 申请公布日期 2013.10.17
申请号 JP20120083601 申请日期 2012.04.02
申请人 SUMITOMO METAL MINING CO LTD 发明人 KAWAKUBO KATSUHIRO
分类号 H01C7/04 主分类号 H01C7/04
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