Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same

摘要

A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. The following can be achieved upon forming a circuit by etching a copper foil of a copper clad laminate: sagging caused by the etching is prevented; a uniform circuit of the intended circuit width is formed; the time required to form a circuit by etching is reduced; etching properties in pattern etching are improved; and the occurrence of short circuits and defects in the circuit width are prevented.