发明名称 Indium Sputtering Target And Method For Manufacturing Same
摘要 An indium sputtering target with a short time to attain a stable film deposition rate once sputtering has begun is provided. An indium sputtering target having a surface to be sputtered with an arithmetic average roughness Ra of from 5 mum to 70 mum prior to sputtering.
申请公布号 US2013270108(A1) 申请公布日期 2013.10.17
申请号 US201213819499 申请日期 2012.08.15
申请人 ENDO YOUSUKE;SAKAMOTO MASARU;JX NIPPON MINING & METALS CORPORATION 发明人 ENDO YOUSUKE;SAKAMOTO MASARU
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址