发明名称 HEAT PIPE
摘要 A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.
申请公布号 US2013269913(A1) 申请公布日期 2013.10.17
申请号 US20070993343 申请日期 2007.02.05
申请人 UEDA SUSUMU;OHSAWA KENJI;TSURUTA KATSUYA;KOTANI TOSHIAKI;MOLEX INCORPORATED 发明人 UEDA SUSUMU;OHSAWA KENJI;TSURUTA KATSUYA;KOTANI TOSHIAKI
分类号 F21V29/00;H01L33/62;F28D15/04;H01L33/64 主分类号 F21V29/00
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