Electronic package-on-package device for manufacturing semiconductor assembly utilized for manufacturing electronic components, has seal layers arranged between substrates, and solder connection for providing coupling between substrates

摘要

The device has a solder connection (33) for providing an electrical coupling and a mechanical coupling between a lower package substrate and an upper package substrate (1, 32). An epoxy seal layer (85) and another epoxy seal layer are arranged between the package substrates. The former seal layer comprises a lower concentration of a solder flow material than the latter seal layer. The former seal layer comprises a form layer that is provided with a hole, where the solder connection extends through the hole. A boundary face is defined between the form layer and the latter seal layer. An independent claim is also included for a method for manufacturing an electronic package-on-package (POP) device.