SEMICONDUCTOR DEVICE AND BURN-IN SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a burn-in substrate that does not need sockets.SOLUTION: A semiconductor device SD in two-direction lead packaging system performs a predetermined burn-in test operation when a power supply voltage VDD is applied to leads LL1 to LL7 which are drawn out in a first direction and a ground voltage VSS is applied to leads LR1 to LR7 which are drawn in a second direction opposite to the first direction.