WIRING BASE MATERIAL FOR MOUNTING ELECTRONIC COMPONENT THEREON, METHOD FOR MANUFACTURING WIRING BASE MATERIAL FOR MOUNTING ELECTRONIC COMPONENT THEREON, ELECTRONIC CIRCUIT MODULE, AND LAND FORMING APPARATUS

摘要

A wiring base material (10) for mounting an electronic component thereon is provided with a conductive member (20) having a land (22) on one surface thereof, and the wiring base material is characterized in that the conductive member (20) has the land (22), and a modified layer formed region (24), which is formed in a region surrounding the land (22), and which has affinity for a solder lower than that in the land (22). In the wiring base material (10), since the conductive member (20) has, in the region surrounding the land (22), the modified layer formed region (24) having the affinity for the solder lower than that in the land (22), it is not necessary to provide a solder resist, and at the time of connecting the electronic component to the land (22), the electronic component can be accurately mounted on the land (22).