ADHESIVE SHEET FOR INSPECTION

摘要

A pressure-sensitive adhesive sheet for testing of the present invention is a pressure-sensitive adhesive sheet for testing wherein a pressure-sensitive adhesive layer is provided on a base film, the base film and the pressure-sensitive adhesive layer have conductivity, and an electrically conductive path is formed therebetween. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside during the test can be prevented.